DBIhybridbonding

DBI®Ultraisanenablinglow-temperature,lowprofiledie-to-waferanddie-to-diehybridbondingtechnologyplatform.Byeliminatingtheneedforcopper.,DBI®isalowtemperaturehybriddirectbondingtechnologythatallowswaferstobebondedwithexceptionallyfinepitch3Delectricalinterconnect.,2022年7月28日—It'sbecomeknownindustry-wideasdirectbondinterconnect(DBI).Hybridbondingextendsfusionbondingwithembeddedmetalpadsinthe ....

參考資訊如下
DBI Ultra Die-to

DBI® Ultra is an enabling low-temperature, low profile die-to-wafer and die-to-die hybrid bonding technology platform. By eliminating the need for copper.

DBI Wafer-to

DBI® is a low temperature hybrid direct bonding technology that allows wafers to be bonded with exceptionally fine pitch 3D electrical interconnect.

Hybrid Bonding Basics

2022年7月28日 — It's become known industry-wide as direct bond interconnect (DBI). Hybrid bonding extends fusion bonding with embedded metal pads in the ...

Hybrid Bonding Basics

2022年8月18日 — It's become known industry-wide as direct bond interconnect (DBI). Hybrid bonding extends fusion bonding with embedded metal pads in the ...

Hybrid Bonding

2018年4月2日 — It's become known industry-wide as direct bond interconnect, or DBI (Figure 1). Figure 1: DBI bonding process. The early days: developing ZiBond

Low Temperature Hybrid Bonding for Die to Wafer Stacking ...

由 G Gao 著作 · 2021 · 被引用 14 次 — The Xperi die to wafer hybrid bonding technology, DBI® Ultra, is now ready for industry adoption and ramp to manufacturing. The bond takes place at room ...

Sub

由 J Mudrick 著作 · 2019 · 被引用 12 次 — This work demonstrates a 2.5-D integration method using a 3 micron Cu DBI process on a 7.5 micron pitch with electrical contacts ranging between 3.8 and 4.8 ...

先進封裝技術再進化：超高密度銅─銅Hybrid ...

2022年7月29日 — 最早由Ziptronix 公司（今Xperi）實現低溫直接接合接點（Direct Bond Interconnection, DBI）的可行性[3]，其接合步驟如圖四所示。首先，準備好晶片 ...